Headquartered in Guangzhou, established in August 2023. The company focuses on the field of semiconductor and electronic grade adhesives, with its main products being semiconductor adhesives and high thermal conductivity related materials. The main application areas of the product are semiconductor packaging (IC), display panel (LED), consumer electronics, and automotive electronics industries. There are in-depth layouts in the fields of conductive adhesives (CDAP), conductive adhesive films (CDAF), non-conductive adhesive films (DAF), and high thermal conductivity sintered materials (copper sintering, silver sintering).
The company gathers professional talents from industries such as Germany's Henkel Ericsson and south Korea's samsung. It insists on building a full chain intellectual property system from research and development, manufacturing to application, and is committed to becoming a top supplier of precious metal materials in the semiconductor packaging and automotive electronics fields.
